Products
MEMS
MEMS (Micro-Electro-Mechanical Systems) microphones are miniature devices that utilize semiconductor manufacturing techniques to integrate electronic and mechanical functionalities.
-
MEMS Microphone
MEMS microphones can withstand higher temperatures and tolerate high-frequency noise, making them suitable for placement in highly complex design schemes without concerns about interference and noise issues. Using silicon fabrication processes, MEMS microphones can easily integrate with ASICs (Application-Specific Integrated Circuits), significantly reducing the component's final size. MEMS microphones can achieve extremely small dimensions, aligning with the ongoing trend in consumer electronics towards thinning and miniaturization.
-
Type Application Dimension(mm) Sound Port NESSIE P/N Sensitivity(dB) SNR(dB) Current Consumption AOP(dBSPL) Directional Analog Speech 3.5*2.65*0.98 Top M3526T-A -38±1 TYP 64 120 128 Omni Bottom M3526B-A -38±1 TYP 64 120 128 Omni 2.75*1.85*0.95 Top M2718T-A -42±1 TYP 58 75 130 Omni Bottom M2718B-A -38±1 TYP 63 75 126 Omni ANC 2.75*1.85*0.95 Top M2718T-AS -42±1 TYP 58 75 130 Omni Bottom M2718B-AS -38±1 TYP 64 75 126 Omni TypeApplication Dimension(mm) Sound Port NESSIE P/N Sensitivity(dBFS) SNR(dB) Current Consumption AOP(dBSPL) Directional Digital Speech 4.0*3.0*1.0 Top M4030T-D -26±1 TYP 65 650 120 Omni, PDM Bottom M4030B-D -26±1 TYP 64 800 120 Omni, PDM 4.0*2.0*1.0 Top M4020T-D -26±1 TYP 65 650 120 Omni, PDM 3.5*2.65*0.98 Top M3526T-D -26±1 TYP 65 600 120 Omni, PDM Bottom M3526B-D -26±1 TYP 65 600 120 Omni, PDM Bottom M3526B-D -37±1 TYP 66 890 132 Omni, PDM 2.75*1.85*0.95 Bottom M2718B-D -26±1 TYP 66 650 120 Omni, PDM ANC 3.5*2.65*0.98 Bottom M3526B-D -37±1 TYP 66 890 132 Omni, PDM Bottom M3526B-D -26±1 TYP 65 800 120 Omni, PDM For further details, please contact us.
Contact Person: Diane Yeh
TEL: 02-86659877 #302
Mobile: 0988425153
Email: diane.yeh@nessie.com.tw
Assistant: Ms. Chu, 02-86659877 #205 -